


Intelligent Solder Paste Handling Solution
SMD BOX SP
SMD BOX SP is an automated solder paste handling system. Solder paste is a vital part of the SMT process, and maintaining its original nature is essential. Proper handling reduces waste and eliminates process risks.
- Solder paste package: Jar, cartridge
- 1D/2D recognition: Yes
- Weight scale: Yes
- Refrigeration Area: Yes
- Ambient temperature area: Yes
- Mixer: Yes
- Scheduled material release: Yes
Specifications
SMD BOX SP: Advanced Solder Paste Handling Solution
The SMD BOX SP is designed to provide a comprehensive, automated solution for handling solder paste in the Surface Mount Technology (SMT) manufacturing process. With features aimed at optimizing solder paste storage, mixing, and release, the SMD BOX SP ensures consistency, accuracy, and efficiency throughout the production line.
Product Features
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Refrigeration Area
Solder paste is highly sensitive to temperature, and improper storage can affect its performance. The SMD BOX SP offers a refrigerated storage area that maintains an optimal temperature range of 5-10°C to ensure solder paste remains in ideal condition for use. -
Ambient Temperature Area
Solder paste should not be used while cold. It needs to reach ambient temperature before breaking the seal of the package, typically requiring four to six hours. The ambient temperature area in the SMD BOX SP is programmable for convenience. -
Internal Mixer
The SMD BOX SP features an internal mixer that ensures an even distribution of any separated materials within the solder paste. The user can control the mixer speed and timing for optimal consistency. -
Automated Release & Traceability
The system allows scheduled release of solder paste to the production line and ensures traceability throughout the process. Traceability is critical for quality control and tracking the entire process from receiving to use.
Solder Paste Handling Process
The SMD BOX SP follows a precise sequence for the safe handling and storage of solder paste, ensuring optimal performance and reducing errors during the production process.
S.No | Process | Area | Completion % |
---|---|---|---|
01 | Receiving Solder Paste | Storing | 20% |
02 | Store in Cooling Area | Cooling | 40% |
03 | Ambient Temperature Area | Ambient Temp. | 60% |
04 | Solder Paste Mixing | Mixer | 80% |
05 | Release to Production Line | Scheduled Release | 95% |
Final | Traceability and Quality Control | Traceability | 100% |
Solder Paste Handling Guidelines
Proper solder paste handling is crucial for maintaining the paste’s performance. Below are some guidelines to follow:
- Temperature: Store solder paste at 20°C (68°F) to 25°C (77°F). Avoid high temperatures which can degrade flux, or low temperatures which can cause paste thickening.
- Humidity: Maintain humidity levels below 60%. Excessive moisture can lead to paste degradation.
- Light: Store in a dark place to prevent light degradation.
- Shelf Life: Use within the manufacturer’s recommended time frame for optimal performance.
- Containers: Use airtight containers to protect against moisture and contaminants.
Benefits of the SMD BOX SP
Automating solder paste handling with the SMD BOX SP delivers numerous advantages:
- Consistency: Ensures accurate and consistent solder paste application, enhancing the quality of electronic assemblies.
- Speed: Increases process speed, reducing overall production time.
- Accuracy: Automates solder paste management, minimizing errors and improving assembly quality.
- Repeatability: Guarantees consistent performance for every cycle, increasing overall efficiency.
- Cost Efficiency: Reduces labor costs through automation, improving production efficiency and profitability.