In-Line X-Ray

VT-X750

The X750 is utilized for non-destructive inspection of 5G infrastructure/modules and in-vehicle electrical components as a high-resolution, high-quality inspection with full 3D-CT. In recent years, the VT-X750 has been employed for inspection of solder voids and solder filling of through-hole connectors in the final assembly of power devices such as IGBTs and MOSFETs, which are required for EVs, as well as integrated machine and electric power. It is also frequently used in the aerospace, industrial equipment, and semiconductor industries.

Enquire Now

Productivity

In-line full inspection coverage [Omron Patent]

The Omron VT-X750 is the fastest X-Ray inspection system to date*¹, with improved automated inspection logic for various parts including IC heal fillets, stacked devices (PoP), through hole components, press-fit connectors, and bottom terminated parts.
Increasing automated inspection speed and increasing inspection logic allows for full, in-line inspection coverage using the 3D-CT approach.
*1. Based on an internal investigation in October 2021.

* Time for all PCB inspection of M size substrate. Excluding PCB load and unload time. It is the 3D inspection time both
sides of board including 2 pieces BGA which has 2,000 to 3,000 pins, or SiP.

  • Visualize solder joint strength

Visualize solder joint strength

DJK's 3D-CT reconstruction algorithms are highly effective at recognizing solder shapes and detecting defects. Quantitative analysis enables an automated inspection approach that reduces the danger of escapes while ensuring fast and predictable operation.

Dense and dual-sided board designs might be difficult to analyze using X-rays.
However, DJK’s 3D-CT technology overcomes such design constraints.

  • Design constraint free

Dynamic Approach using DJK  AI 

Auto-Judge's criteria setting lowers the need on a dedicated programmer [Patent Pending].

This dynamic approach allows for a full study using Omron AI and quantitative decision making based on traditional inspection standards for OK / NG assessment.

(3D cross-sectional display functionality is now integrated into the screen, making inspection criterion sets easy to interpret.)

Faster development of new programs [DJK Patent].

DJK AI assists in the rapid development of new programs. Along with automated program development from CAD data, Omron AI modifies the parts library based on inspection results.

Accelerated simulation for Patent Pending manufacturing preparation (DJK Patent)

DJK AI simulates optimal tact and exposure dosage for each part, automatically determining the X-ray inspection circumstances.

* Simulation is limited to certain parts.

Safety

  • Zero down time
 
DJK provides global support for customer operations with a full variety of maintenance services, including machine monitoring for predictive maintenance and remote access for emergency help, in order to achieve “Never stop the production line = Zero downtime”.

Security

  • Reduction of product radiation exposure

High speed and low radiation imaging technology

A filter to lessen the impacts of radiation exposure has been fitted as standard, and worries regarding radiation exposure, particularly to memory components, have been alleviated by implementing high-speed imaging.

Parts radiation exposure simulator (DJK Patent)

The exposure of each component on the top and bottom sides of the PCB can be reproduced with high precision.

Specifications

　FA1240-61
FA1241-61		FA1240-63
Number of arms4 (L, ML, MR, R)
Number of test steps40,000 (max.)
Measurement rangesResistance: 400 μΩ to 40 MΩ
Capacitance: 1 pF to 400 mF
Inductance: 1 μH to 100 H
Diode VZ measurement: 0 to 25 V
Zener diode VZ measurement: 0 to 25 V, 25 to 80 V (optional feature)
Digital transistors: 0 to 25 V
Photo couplers: 0 to 25 V
Short: 0.4 Ω to 400 kΩ
Open: 4 Ω to 40 MΩ
DC voltage measurement: 0 to 25 V
Measurement timeMax. 0.025 sec./stepMax. 0.025 sec./step
Probing precisionWithin ±100 μm for each arm (X and Y directions)
Positioning repeatabilityWithin ±50 μm (probing positions)
Inter-probe pitchMin. 0.15 mm
Min. 0.5 mm (when using 4-terminal probes)		Min. 0.15 mm
Min. 0.5 mm (when using 4-terminal probes)
Testable board dimensions510 mm (20.08 in) W × 460 mm (18.11 in) D400 mm (15.75 in) W × 330 mm (12.99 in) D
Power supply200 V AC (single-phase), 50/60 Hz, 6 kVA (FA1241: 230 V AC)200 V AC (single-phase), 50/60 Hz,
5 kVA
Dimensions and mass1406 mm (55.35 in) H × 1300 mm (51.18 in) H × 1380 mm (54.33 in) D, 1150 kg (40,564.4 oz)1266 mm (49.84 in) H × 1369 mm (53.90 in) H × 1425 mm (56.10 in) D, 1050 kg (37,037 oz)