YCC-50 / YCC-51

Bumping Solder Paste attempts to address the present issue of excessive voids in IC Packaging Manufacturers. SMMI's applications engineers specialize on designing formulas with a reduced Void (<100000ppm). Our clients have accepted it, which reduces voids and improves manufacturing process performance. Our Bumping Solder Paste was well-developed to have a 6-month shelf life and may be stored at temperatures below 10 degrees Celsius.