Solder Sphere

BGA Solder Sphere is comprised of pure metals to achieve precise alloy compositions. We created and produced using a thorough research and quality control policy.

Our Solder Spheres for PBGA, CBGA, TBGA, CSP, and Flip Chip applications are manufactured by UMT (Ultra Micron Technology) to ensure spheres with exact diameters, brilliant, lustrous surface finishes, and high sphericity. We have developed our own technology that decreases raw material costs, resulting in competitive pricing that benefits users. We can meet customer requests for various sizes using our newest in-house production machine. BGA Sphere is offered per clients' specifications.