Adhesive
Adhesive
SM-150G and SM-155P are single-component epoxy adhesives created exclusively for gluing surface mount devices to PCBs in a lead-free procedure. SM-150G is ideal for the glue dot process, whereas SM-155P is suitable for the printing machine method. SM-150G and SM-155P also have a good plastic shape and a strong and steady adhesive strength for a variety of component parts.
Specifications
* Physical Characteristics and Application
| <span “=””>NO. | Items | Specification |
| 1 | Chemical Type | Epoxy |
| 2 | Components | One component |
| 3 | Cure Type | Heat cure |
| 4 | Application | Surface mount adhesive |
| 5 | Suitable Process | SM-150G : Glue dot process SM-155P : Printing machine process |
| 6 | Viscosity (Brookfield / 5.0rpm / 25℃ ) |
SM-150G：55,000 ± 10000 cps SM-155P：35,000 ± 7000 cps |
| 7 | Thixotropy index | SM-150G：6.5 ± 1.0 SM-155P：5.0 ± 0.7 |
* Typical Curing Performance
Curing rates depend on the mass of material to be heated and intimate contact with the heat sources. Other curing conditions may also yield satisfied results. Recommended conditions for curing are as follows.
| Recommended Curing Condition | |||
| Curing Temperature | 150℃ | 125℃ | 100℃ |
| Curing Time | 1.5~2.0 min | 2.0~3.0 min | 9.0~10 min |
* Performance of Push-off Strength
| Push-off Strength | Shear Strength (N/mm2) | Shear forces (Kgf) | |
| Chip Size | (Chip:1206R) | ≧15.0 | ≧7.0 |
| (Chip:0805R) | ≧10.0 | ≧2.5 | |
| (Chip:0603R) | ≧10.0 | ≧1.5 | |
* Packaging
SM-150G is syringe based packaging, and the capacities are 10mL, 30mL, and 300ml. SM-155P can be provided with syringe and jar packaging. The capacity is 250mL.
