YHT-00
Horizontal Turn
This unit switches the flow direction of PCBs clockwise and counterclockwise.
- Touch screen (Operating panel)
- Tower lamp
- Turning direction – Clockwise / Counter clockwise
- Controlled by PLC
- Manual width adjustment
- SMEMA interface
Specifications
| Item | Standard | ||||
|---|---|---|---|---|---|
| Line Flow | Left to Right | Right to Left | |||
| Fixed Rail | Front | Rear | |||
| Pass Line (mm) | 950 ± 20 | 900 ± 20 | |||
| Voltage & Frequency | 220V±(10%) & 50 ~ 60Hz | 110V±(10%) & 50~60Hz | |||
| PCB Size |
| ||||
| Min.PCB (LXW) (mm) | 70 X 50 | ||||
| Max.PCB (LXW) (mm) |
| ||||
| Item | SMT | POST PROCESS | |||
| PCB Top/Bottom Clearance (mm) | 30 / 25 | 60 / 60 | |||
| PCB Edge (mm) | 3 | 5 | |||
| PCB Loading Weight (kg) | 3 | 8 | |||
| Conveyor Belt | Flat edge belt | Pin Chain | |||
| Conveyor Speed (mm/sec) * | 200 | 100 | |||
| PCB Thickness (mm) | 0.6 ~ 4.0 | ||||
| PCB Color | Green | ||||
| PCB In/Out Sensor | Single sensor | ||||
| Mode | By pass / Horizontal Turn | ||||
| Turning Direction | Clockwise / Counter Clockwise | ||||
| Width Adjustment * | Manual | ||||
| Interface | SMEMA Pin No. 1, 2, 3, 4, 5, 6 | ||||
| Smema Cable | 3m / 1 ea | ||||
| Alarm | Tower lamp (3 colors) | ||||
| Color * | SR RAL 7035 : NON ESD (H-GY2912-T3-Samhwa Paints) | ||||
| Air Supply | 0.5Mpa(5bar) | ||||
| Air Usage | 6.20 ℓ/min | ||||
| Electricity Consumption | 465W | ||||
Option Specification
| Item | CODE No. | Option | |
|---|---|---|---|
| Conveyor Speed (mm/sec) * | SMT | O-10O-HW0-0104 | 1~200 / Analog / 1ea |
| POST PROCESS | 1~100 / Analog / 1ea | ||
| Width Adjustment * | O-10O-HW0-0205 | Auto | |
| Width Synchronization | O-10O-SW0-0200 | via RS-485 | |
| Line Control | O-20O-LC0-0100 | Hermes | |
| O-20O-LC0-0200 | Smart kit (LAN communication PLC) | ||
| Color * | O-40O-CO0-0100 | ESD powder coating(RAL 7035) | |
* Time for all PCB inspection of M size substrate. Excluding PCB load and unload time. It is the 3D inspection time both
sides of board including 2 pieces BGA which has 2,000 to 3,000 pins, or SiP.
- Visualize solder joint strength
Visualize solder joint strength
DJK's 3D-CT reconstruction algorithms are highly effective at recognizing solder shapes and detecting defects. Quantitative analysis enables an automated inspection approach that reduces the danger of escapes while ensuring fast and predictable operation.
Dense and dual-sided board designs might be difficult to analyze using X-rays.
However, DJK’s 3D-CT technology overcomes such design constraints.
- Design constraint free
Dynamic Approach using DJK AI
Auto-Judge's criteria setting lowers the need on a dedicated programmer [Patent Pending].
This dynamic approach allows for a full study using Omron AI and quantitative decision making based on traditional inspection standards for OK / NG assessment.
(3D cross-sectional display functionality is now integrated into the screen, making inspection criterion sets easy to interpret.)
Faster development of new programs [DJK Patent].
DJK AI assists in the rapid development of new programs. Along with automated program development from CAD data, Omron AI modifies the parts library based on inspection results.
Accelerated simulation for Patent Pending manufacturing preparation (DJK Patent)
DJK AI simulates optimal tact and exposure dosage for each part, automatically determining the X-ray inspection circumstances.
* Simulation is limited to certain parts.
Safety
- Zero down time
Security
- Reduction of product radiation exposure
High speed and low radiation imaging technology
A filter to lessen the impacts of radiation exposure has been fitted as standard, and worries regarding radiation exposure, particularly to memory components, have been alleviated by implementing high-speed imaging.
Parts radiation exposure simulator (DJK Patent)
The exposure of each component on the top and bottom sides of the PCB can be reproduced with high precision.
