ZM-R5860
Hot Air BGA Rework Station
DJK's ZM-R5860 Hot Air BGA Rework Station features three temperature zones. The system features independent control, convection hot air heating, adjustable lower temperature zone height, a high-precision K-type thermocouple with accuracy up to ± 3 ℃, and dynamic APR multi-loop closed-loop control selective reflow process. Integrated high-power, constant-current cooling fan.
Seamark ZM, one of the most recognized BGA Rework Station suppliers, offers the best BGA Rework Station in good quality. If you want to know the pricing of the Seamark ZM R5860, please contact us right away!
Temperature Curve Setting
- High-definition touch screen operation, real-time display and, editing of temperature curves, each group of temperature curves can be set to 8 segments, 100 groups of temperature curves can be stored, with temperature self-organizing function.
Laser Red-dot Positioning Guide
- Laser indicator for PCB and component positioning.
Vacuum Adsorption
- The external vacuum suction pen is convenient for taking BGA.
Specifications
| Project | Specification |
|---|---|
| Power Supply | AC220V±10% 50/60HZ |
| Power | 5.0KW(Max), Top heater(0.8KW), Bottom heater (1.2KW), IR Preheater (2.7KW), Other(0.3KW) |
| PCB Size | 410*370mm(Max); 10*10mm(Min) |
| BGA Chip Size | 40*40mm(Max); 10*10mm(Min) |
| IR Heater Size | 375*285mm |
| Temperature Sensor | 1 pcs |
| Operation Method | 7″ HD touch screen |
| Control System | Autonomous heating control system V1 (software copyright) |
| Alignment System | Laser dot |
| Vacuum Adsorption | Manual |
| Temperature Control | K-type thermocouple closed-loop control with accuracy up to ±3℃ |
| Positioning | V-groove with universal fixture |
| Dimensions | L635*W620*H655mm |
| Weight | 43.5KG |
Option Specification
The operation mode of the Seamark ZMR5860 BGA Machine involves several steps:
Preheating:
The PCB is preheated to a suitable temperature to prevent thermal shock to the board when the hot air is applied.
Alignment:
The BGA component is accurately aligned with the PCB using the machine’s vision alignment system.
Soldering/Desoldering:
Hot air is applied to the BGA component to melt the solder balls. For desoldering, the component can then be removed. For soldering. the component is placed on the PCB and the solder is allowed to cool and solidify , creating a strong electrical and mechanical connection.
Cooling:
The PCB is cooled down to room temperature in a controlled manner to prevent thermal stress and warping.