ZM-R8650

Fully Automatic BGA Rework Station

The R8650C fully automatic BGA rework station features visible alignment. This BGA repair station functions as an automated desoldering machine and is ideal for the automatic visual placement of various chip devices on large PCB boards (such as 5G communication boards), as well as automatic welding and PCB soldering stations. This automatic SMD soldering rework station machine can be combined with SAP/ERP to realize the software linkup (optional), and to realize the temperature curve sub-board with S/N as the retroactive condition.

As a responsible BGA rework station supplier in China, DJK promises to provide our best Automatic Soldering Machine at a reasonable price.

Specifications

Feature Specification
Power Supply AC380V±10% 50/60HZ
Power 22KW(Max), Top heater(2KW), Bottom heater (2KW), IR Preheater (16KW), Other(2KW)
PCB Size 660*600mm(Max); 10*10mm(Min)
BGA Chip Size 100*100mm(Max); 1*1mm(Min)
IR Heater Size 640*520mm
Motion Control X/Y/Z
Temperature Sensor 8 Pcs
Control System Industrial PC + Servo motion control system
Display System 24″ SD display
Alignment System 2 Million pixels vision alignment
Vacuum Adsorption Full automatic
Alignment Accuracy ±0.025mm
Temperature Control K-type thermocouple (closed-loop), each unit independent temperature control, temperature accuracy up to ±1℃
Feeding Device Semi-automatic
Positioning L shape + universal fixture (shaped fixture can be customized)
Dimensions L1235*W1215*H1850mm
Weight 660KG
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Option Specification

  • Precise Visual Alignment
    Two sets of high-definition industrial cameras are used, and the repeat placement accuracy reaches ± 0.01mm. The 5 million pixels high-definition industrial camera system is for accurate measurement and positioning of the chip, the automatic vision software system automatically corrects the angle, and the image is displayed in HD.

    High-definition CCD (5 million pixels) and high-definition CCD (1.3 million pixels) industrial cameras can accurately detect with telecentric lenses to avoid image distortion, eliminate measurement errors, achieve accurate alignment, and repeat alignment accuracy can reach ± 0.01mm.
  • ESD Lonizer
    Equipped with ionizer, which effectively eliminates static electricity on the board and protects the product.
  • Precise Motion Platform
    It adopts an industrial PC and servo motion control system to accurately control the X/Y/Z four-axis gantry structure to operate fully automatically and independently. It adopts a grinding marble platform and a precision grinding screw. The visual accuracy can reach ± 0.01mm.
  • Multifunctional Control Feature
    The self-developed software system realizes fast positioning and stable temperature curve (with curve analysis function), easy operation and setting, and can automatically generate record files to achieve traceability of historical parameters. The operation interface is simple and fast, and a professional operation interface (system parameter setting, working mode setting, heating parameter setting, data recording, etc.) is set for different product characteristics, and there are Chinese and English interfaces to choose from.
  • Three Independently Editable Heat Zones
    Three heat zones independently programmed and controlled; convection hot air heating in the upper zone and the lower zone, the lower zone adopts a large area heating wire layout, suitable for the repair of larger BGA, and the infrared preheating zone uses the German imported mediumwave ceramic infrared heating Plate heating. The area can reach 645 * 524mm.
  • Stable Temperature Control
    High-definition K-type thermocouple with accuracy up to ± 1 ℃, dynamic PID multi-loop closed control selective reflow soldering process. With intelligent temperature compensation, and automatic memory function.
  • Bottom Heating System
    The bottom preheating adopts the heating plate imported from Germany, and the built-in temperature measuring probe is more accurate, which effectively solves the heating temperature control effect. The bottom moving temperature zone automatically moves with the head to improve the board rework efficiency.